By Er?Ping Li(auth.), Lajos Hanzo(eds.)
New complicated modeling equipment for simulating the electromagnetic homes of advanced three-d digital systems
Based at the author's broad learn, this booklet units forth verified and confirmed electromagnetic modeling and simulation equipment for reading sign and gear integrity in addition to electromagnetic interference in huge advanced digital interconnects, multilayered package deal constructions, built-in circuits, and revealed circuit forums. Readers will observe the country of the know-how in digital package deal integration and published circuit board simulation and modeling. as well as well known full-wave electromagnetic computational equipment, the publication provides new, extra refined modeling equipment, supplying readers the main complicated instruments for studying and designing huge advanced digital structures.
Electrical Modeling and layout for 3D process Integration starts with a finished evaluate of present modeling and simulation equipment for sign integrity, energy integrity, and electromagnetic compatibility. subsequent, the publication publications readers through:
The macromodeling procedure utilized in and electromagnetic modeling and simulation of advanced interconnects in three-d built-in systems
The semi-analytical scattering matrix approach in line with the N-body scattering thought for modeling of 3-dimensional digital package deal and multilayered published circuit forums with a number of vias
Two- and third-dimensional essential equation equipment for the research of energy distribution networks in three-d package deal integrations
The physics-based set of rules for extracting the similar circuit of a fancy strength distribution community in 3-dimensional built-in platforms and published circuit boards
An identical circuit version of through-silicon vias
Metal-oxide-semiconductor capacitance results of through-silicon vias
Engineers, researchers, and scholars can flip to this booklet for the newest strategies and strategies for modeling and layout of digital packaging, third-dimensional digital integration, built-in circuits, and published circuit boards.
Chapter 1 creation (pages 1–15):
Chapter 2 Macromodeling of advanced Interconnects in 3D Integration (pages 16–96):
Chapter three 2.5D Simulation approach for 3D built-in platforms (pages 97–184):
Chapter four Hybrid quintessential Equation Modeling tools for 3D Integration (pages 185–240):
Chapter five Systematic Microwave community research for 3D built-in platforms (pages 241–330):
Chapter 6 Modeling of Through?Silicon Vias (TSV) in 3D Integration (pages 331–360):
Read or Download Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC PDF
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Extra info for Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
1 Illustration of methods for electrical modeling and characterization of interconnects, packages and PCBs, for signal, power integrity and electromagnetic compatibility (SI/PI/EMC). The macromodeling technique resolves the mixed time-frequency simulation issue. 2 Schematic of an N-port network with voltages and currents shown at the ports. active devices, and no nonreciprocal media such as ferrites, and plasmas. A network is symmetrical if its input is exchangeable with its output. Symmetrical networks are not necessarily physically symmetrical.
Adv. , vol. 31, no. 3, pp. 536–543, 2008. X. C. Wei, G. P. Zou, E. P. Li, and X. Cui, Extraction of equivalent network of arbitrarily shaped power-ground planes with narrow slots using a novel integral equation method, IEEE Trans. Microw. , vol. 58, no. 11, pp. 2850– 2855, 2010. References 13  M. R. Abdul-Gaffoor, H. K. Smith, A. A. Kishk, and A. W. A. G. A. W. Glisson, Simple and efﬁcient full-wave modeling of electromagnetic coupling in realistic RF multilayer PCB layouts, IEEE Trans. Microw.
26] A. E. Engin, W. John, G. Sommer, W. Mathis, and H. Reichl, Modeling of striplines between a power and a ground plane, IEEE Trans. Adv. Packag, vol. 29, no. 3, pp. 415–426, 2006.  W. K. Gwarek, Analysis of an arbitrarily shaped planar circuit: A time-domain approach, IEEE Trans. Microw. , vol. 33, no. 10, pp. 1067–1072, 1985.  J. E. Schutt-Aine, Latency insertion method (LIM) for the fast transient simulation of large networks, IEEE Trans. Circuits Syst. I, vol. 48, no. 1, pp. 81–89, 2001.
Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC by Er?Ping Li(auth.), Lajos Hanzo(eds.)