Get Electrical Modeling and Design for 3D System Integration: 3D PDF

By Er?Ping Li(auth.), Lajos Hanzo(eds.)

ISBN-10: 0470623462

ISBN-13: 9780470623466

ISBN-10: 1118166728

ISBN-13: 9781118166727

New complicated modeling equipment for simulating the electromagnetic homes of advanced three-d digital systems

Based at the author's broad learn, this booklet units forth verified and confirmed electromagnetic modeling and simulation equipment for reading sign and gear integrity in addition to electromagnetic interference in huge advanced digital interconnects, multilayered package deal constructions, built-in circuits, and revealed circuit forums. Readers will observe the country of the know-how in digital package deal integration and published circuit board simulation and modeling. as well as well known full-wave electromagnetic computational equipment, the publication provides new, extra refined modeling equipment, supplying readers the main complicated instruments for studying and designing huge advanced digital structures.

Electrical Modeling and layout for 3D process Integration starts with a finished evaluate of present modeling and simulation equipment for sign integrity, energy integrity, and electromagnetic compatibility. subsequent, the publication publications readers through:

  • The macromodeling procedure utilized in and electromagnetic modeling and simulation of advanced interconnects in three-d built-in systems

  • The semi-analytical scattering matrix approach in line with the N-body scattering thought for modeling of 3-dimensional digital package deal and multilayered published circuit forums with a number of vias

  • Two- and third-dimensional essential equation equipment for the research of energy distribution networks in three-d package deal integrations

  • The physics-based set of rules for extracting the similar circuit of a fancy strength distribution community in 3-dimensional built-in platforms and published circuit boards

  • An identical circuit version of through-silicon vias

  • Metal-oxide-semiconductor capacitance results of through-silicon vias

Engineers, researchers, and scholars can flip to this booklet for the newest strategies and strategies for modeling and layout of digital packaging, third-dimensional digital integration, built-in circuits, and published circuit boards.

Chapter 1 creation (pages 1–15):
Chapter 2 Macromodeling of advanced Interconnects in 3D Integration (pages 16–96):
Chapter three 2.5D Simulation approach for 3D built-in platforms (pages 97–184):
Chapter four Hybrid quintessential Equation Modeling tools for 3D Integration (pages 185–240):
Chapter five Systematic Microwave community research for 3D built-in platforms (pages 241–330):
Chapter 6 Modeling of Through?Silicon Vias (TSV) in 3D Integration (pages 331–360):

Show description

Read or Download Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC PDF

Best design books

Download PDF by Dean Herald, Danny Kildare: 21st Century Residential Landscape Design

This fantastically illustrated booklet takes the reader on a trip via a few awesome gardens which have been landscaped by means of certainly one of Australia's major panorama designers, Dean bring in of 'Rolling Stone Landscapes'.

21st Century Residential panorama layout showcases over 20 designs produced by way of Dean, who has completed the head of the panorama layout in profitable a gold medal on the prestigious Royal Horticultural Society Chelsea Flower convey in London and Australian Landscaper of the 12 months. the fashionable residential panorama has replaced so dramatically over the past two decades with the indoor-outdoor idea changing into a residing house of the kin domestic. combined with unique components for alfresco cooking/dining and the further pleasure of a swimming pool layout, you have got a soothing surroundings and a personal retreat on your personal backyard—this is twenty first Century Residential panorama layout.

The courting among backyard and water has regularly been an excellent blend end result of the tranquillity and delight it grants via sight, sound and use.

Dean bring in has completed the head of the panorama layout in profitable a gold medal on the prestigious Royal Horticultural Society Chelsea Flower exhibit in London through the Queen

Between 2003 and 2011 Dean usher in and his hugely expert crew have equipped seven express gardens and been provided a gold medal on every one party, including 3 layout excellence awards on the Melbourne overseas Flower and backyard express. additionally Australian Landscaper of the 12 months.

Transient-Induced Latchup in CMOS Integrated Circuits by Ming-Dou Ker PDF

The booklet all semiconductor gadget engineers needs to learn to achieve a pragmatic consider for latchup-induced failure to provide lower-cost and higher-density chips. Transient-Induced Latchup in CMOS built-in Circuits  equips the training engineer with all of the instruments had to deal with this frequent challenge whereas turning into more adept at IC structure.

Handbook: Hbk Gear Design 2nd Ed. - download pdf or read online

This new version presents wide info to designers on a variety of facets of gears and gearing structures. Very accomplished in its assurance, the instruction manual includes sufficient tables, illustrative examples and diagrams to allow designers arrive at speedy ideas for his or her difficulties. The instruction manual relies on ISO standards and is a special mixture of sensible in addition to the theoretical points of substances designs.

Extra info for Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Sample text

1 Illustration of methods for electrical modeling and characterization of interconnects, packages and PCBs, for signal, power integrity and electromagnetic compatibility (SI/PI/EMC). The macromodeling technique resolves the mixed time-frequency simulation issue. 2 Schematic of an N-port network with voltages and currents shown at the ports. active devices, and no nonreciprocal media such as ferrites, and plasmas. A network is symmetrical if its input is exchangeable with its output. Symmetrical networks are not necessarily physically symmetrical.

Adv. , vol. 31, no. 3, pp. 536–543, 2008. X. C. Wei, G. P. Zou, E. P. Li, and X. Cui, Extraction of equivalent network of arbitrarily shaped power-ground planes with narrow slots using a novel integral equation method, IEEE Trans. Microw. , vol. 58, no. 11, pp. 2850– 2855, 2010. References 13 [21] M. R. Abdul-Gaffoor, H. K. Smith, A. A. Kishk, and A. W. A. G. A. W. Glisson, Simple and efficient full-wave modeling of electromagnetic coupling in realistic RF multilayer PCB layouts, IEEE Trans. Microw.

26] A. E. Engin, W. John, G. Sommer, W. Mathis, and H. Reichl, Modeling of striplines between a power and a ground plane, IEEE Trans. Adv. Packag, vol. 29, no. 3, pp. 415–426, 2006. [27] W. K. Gwarek, Analysis of an arbitrarily shaped planar circuit: A time-domain approach, IEEE Trans. Microw. , vol. 33, no. 10, pp. 1067–1072, 1985. [28] J. E. Schutt-Aine, Latency insertion method (LIM) for the fast transient simulation of large networks, IEEE Trans. Circuits Syst. I, vol. 48, no. 1, pp. 81–89, 2001.

Download PDF sample

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC by Er?Ping Li(auth.), Lajos Hanzo(eds.)

by Paul

Rated 4.37 of 5 – based on 40 votes
This entry was posted in Design.