By Helbert, J.N.(eds.)
This instruction manual supplies readers a detailed examine the total know-how of printing very excessive answer and excessive density built-in circuit (IC) styles into skinny withstand strategy move coatings - together with optical lithography, electron beam, ion beam, and X-ray lithography. The book's major topic is the distinctive printing procedure had to in achieving quantity excessive density IC chip creation, specially within the Dynamic Random entry reminiscence (DRAM) undefined.
The e-book leads off with a comparability of varied lithography tools, overlaying the 3 significant patterning parameters of line/space, solution, line facet and trend function measurement keep watch over. The book's clarification of face up to and withstand procedure apparatus expertise may be the 1st functional description of the connection among the face up to technique and gear parameters. the fundamentals of face up to know-how are thoroughly lined - together with a complete bankruptcy on withstand procedure defectivity and the aptitude yield proscribing impact on equipment creation.
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Additional info for Handbook of VLSI Microlithography - Principles, Technology and Applications
28] All of the non-optical options here, ion projection, Scalpel, EUV and even the older x-ray projection technique, require sophisticated and expensive mask or reticle support, and it may be that some of these are bypassed entirely by mainstream IC production. 25 µm and below. First of all, a 9 × 9" reticle blank technology must be developed and scaled up. New resists, resists that aren’t merely handme-down systems, must be developed; the problem here is that resist manufacturers don’t see the return potential.
Throughput vs. cost of fabrication and yields are becoming the primary drivers but still must be considered with the flexibility necessary to run a multiple number of processes and usually an even larger set of products. The processes will be mature with a moderate degree of process upgrade and incorporation of new versions of an existing process. Product volume will start to reach into the hundreds per month and could even be in the thousands. This is the first class where configuration control, certification of process, and qualification of the line and products start to become very important issues.
52] ASML will deliver their first 193 nm full-field exposure tool in early 1999, while SVGL expects to deliver their first tool also in the first half of 1999. In other words, as the Delphi roadmap indicates, many experts think that the 150-nm technology node, and even the 130-nm node, and some applications of 100-nm nodes are still the territory of 248-nm DUV with full application of OPC, PSM, and OAI technologies. But achieving optical lithography at this level will clearly be an economic issue, and 36 Handbook of VLSI Microlithography economic comparisons will be measured against the costs of 193-nm DUV, not NGL.
Handbook of VLSI Microlithography - Principles, Technology and Applications by Helbert, J.N.(eds.)