Manufacturing Processes 2: Grinding, Honing, Lapping - download pdf or read online

By Fritz Klocke

ISBN-10: 354092258X

ISBN-13: 9783540922582

ISBN-10: 3540922598

ISBN-13: 9783540922599

The ebook sequence on production approaches for engineers are the reference paintings for clinical and commercial specialists. This quantity on Grinding, Honing and Lapping starts off from the fundamentals of innovative engagement and describes the features of abrasive instruments and grinding fluids. Grinding of other fabrics (steel, forged iron, challenging and brittle fabrics, nickel and titanium) is taken care of intensive. The parameters of other grinding approaches, references to strategy implementations in addition to regular commercial functions are likewise special. in addition to honing and lapping, useful insights into sharpening are supplied and certain abrasive techniques like ultrasound assisted grinding are presented.

The booklet seems within the RWTHedition sequence in addition to the opposite four volumes of the reference work.

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Additional info for Manufacturing Processes 2: Grinding, Honing, Lapping

Example text

3-6. Comparison of the microstructure and fracture properties of fused corundum and sol-gel corundum Fig. 3-7 shows that the temperature conductivity of Al2O3 reduces significantly with increasing temperature. Therefore, at high temperatures, one can expect that the heat stress will concentrate increasingly on the cutting edge and that extreme temperature peaks will occur here. Since, with increasing temperature, the thermal coefficient of expansion also goes up, temperature differences lead additionally to increasingly large thermal stresses in the grit.

Since, as the sequence continues, deformation processes and chip formation appear simultaneously, it is decisive for the efficacy of material removal just how much of the chip thickness hcu is actually produced as chips and thus how large the effective chip thickness hcu eff is (Fig. 26). Vc high friction cutting edge η chip lateral bulging cut-off point hcu eff Tμ μ I II III hcu penetration path Vc low friction cutting edge η chip lateral bulging cut-off point hcu eff Tμ μ I II III elastic spring-back material flow Fig.

Besides a diffusion of sodium and silicon in the interior of the grit, crystal 40 3 Structure and Composition of Grinding Wheels growth transpires when exposed to higher temperatures. This interferes with the self-sharpening properties of the abrasive grits. Thus, in the case of sintered corundum, low-alkaline fused bonds with the lowest possible melting point are used. Should high requirements be placed on the grinding component’s profile accuracy and dressing capability of the wheel, the hardness and strength of the bond can be enhanced by increasing the amount of glass phase.

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Manufacturing Processes 2: Grinding, Honing, Lapping by Fritz Klocke


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