By Badih El-Kareh, Lou N. Hutter
This publication covers glossy analog elements, their features, and interactions with strategy parameters. It serves as a entire advisor, addressing either the theoretical and functional elements of recent silicon units and the connection among their electric homes and processing stipulations. in keeping with the authors’ large adventure within the improvement of analog units, this e-book is meant for engineers and scientists in semiconductor learn, improvement and production. the issues on the finish of every bankruptcy and the varied charts, figures and tables additionally make it acceptable to be used as a textual content in graduate and complicated undergraduate classes in electric engineering and fabrics science.
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Extra info for Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability
Childs, H. Deshpande, K. Dev, G. Ding, T. Ghani, O. Golonzka, W. Han, J. He, R. Heussner, R. James, I. Jin, C. Kenyon, S. Klopcic, S-H. Lee, M. Liu, S. Lodha, B. McFadden, A. Murthy, L. Neiberg, J. Neirynck, P. Packan, S. Pae, C. Parker, C. Pelto, L. Pipes, J. Sebastian, J. Seiple, B. Sell, S. Sivakumar, B. Song, K. Tone, T. Troeger, C. Weber, M. Yang, A. Yeoh, and K. 171um2 SRAM cell size in a 291 Mb array,” IEEE IEDM Tech. Digest, 1-3, 2008. 9. J. mvp/id/4682, May 2010. 10. K. M. Cao, W. Liu, X.
Lee, M. Liu, S. Lodha, B. McFadden, A. Murthy, L. Neiberg, J. Neirynck, P. Packan, S. Pae, C. Parker, C. Pelto, L. Pipes, J. Sebastian, J. Seiple, B. Sell, S. Sivakumar, B. Song, K. Tone, T. Troeger, C. Weber, M. Yang, A. Yeoh, and K. 171um2 SRAM cell size in a 291 Mb array,” IEEE IEDM Tech. Digest, 1-3, 2008. 9. J. mvp/id/4682, May 2010. 10. K. M. Cao, W. Liu, X. Jin, K. Vasanth, K. Green, J. Krick, T. Vrotsos, and C. Hu, “Modeling of pocket implanted MOSFETs for anomalous analog behavior,” IEEE IEDM, Tech.
W. Nagel and D. O. Pederson, “SPICE (Simulation Program with Integrated Circuit Emphasis),” Memorandum No. ERL-M382, University of California, Berkeley, Apr. 1973. 16. G. Ritchie, J. Candy, and W. Ninke, “Interpolative digital-to-analog converters,” IEEE Trans. , COM-22 (11), 1797-1806, 1974. 17. I. Galton, “Why dynamic-element-matching DACs work,” IEEE Trans. Circuits. Syst. Express Briefs, 57 (2), 69-74, 2010. 18. G. Temes and J. Candy, “A tutorial discussion of the oversampling method for A/D and D/A conversion,” IEEE Symp.
Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability by Badih El-Kareh, Lou N. Hutter